PoP - Package-on-Package BGA assembly
The demand to design and build products using (Package on Package) is increasing rapidly from customers involved in hand held products, such as mobile communications, PDA, tablet and camera based technology.
From our leading edge production facility, Gemini Tec provides a PCB assembly service for package-on-package (PoP) technology devices. We are the only UK manufacture to use two state-of-the-art solder jet printers, allowing customers fast and lower cost access to this manufacturing technology.
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two packages are installed on top of each other, i.e. stacked, with a standard interface to route signals between them. This allows a much higher component density PCB design to be used.
Electrically, PoP offers benefits by minimising track length between different interoperating parts, such as a controller and a memory. This yields better electrical performance of devices, since shorter routing of interconnections between circuits yields faster signal propagation and reduced noise and cross-talk.
Using our MYCRONIC solder jet printers, with their highly controlled Z-height paste control, solder paste deposits can be printed to both PCB’s and ASICC logic dies during the same manufacturing cycle. Our highly flexible MYCRONIC chip placers can accurately place stacked memory dies to form the BGA PoP assembly. Our facility uses fully automated PCB handling to mirror large-scale volume assembly techniques.
In addition to creating a bespoke thermal profile to suit the product, we use vacumm based vapour phase reflow for void free production. Process validation is completed with X-ray, ERSA optical camera inspection, X J-tag and AOI inspection.
The image shows a typical hand held product manufactured using a 0.35 mm pitch package-on-package device, built at Gemini Tec. The product is built as a typical double-sided surface mount board, except with an additional pass through the solder jet printing line, to paste the logic chip before placement and the final reflow process. The ability to place solder paste onto PoP devices and conduct the correct thermal profile is key to producing high yield PCB assemblies for PoP technology products.
We provide manufacturing services for package-on-package BGA assembly (PoP devices) for rapid prototype to medium batch production orders. Our service is suitable for a wide variety of products such as; niche applications of 1-1000 batch sizes, short product life cycles, development boards and NPI prior to mass volume manufacture.
If you are considering the use of PoP (Package-on-Package) technology, contact us for more assistance. We provide a full turnkey service from PCB design to full production, backed with over 36 years of industry experience. Tel +44 (0) 1252 333 444
Customer feedback on the service we provide:
"Thank you for your efforts in producing this first run of products using the 0.4 mm Package-On-Package device, we are pleased to say we have passed 100% of the batch - and we can now move ahead to production very soon"