Gemini has been a innovative service provider to the electronics industry, since its origins in 1974. Gemini is a privately owned family concern, managed by its founder and current managing director. Gemini has grown and maintained a stable environment to supply & support it's clients, whilst being able to increase our core competencies to become a true flexible contract manufacturer.

Today, Gemini employs in excess of 35 full time staff, with a turnover in excess of £2.5 million. We employ a highly skilled workforce and with continued investment into leading edge equipment means that we successfully anticipate the needs of our clients and innovative technologies - both current and future.

The core activities at Gemini are:

• PCB design, high speed digital specialist.
• Complex mixed technology PCB assembly.
• CEM services.
• Electro mechanical assembly, wiring and box build.
• Functional, ICT and AOI test services.
• Added value services include: PCB manufacture & product management.

A unique and close combination of the core service's ensures clients benefit from working with one key supplier. Gemini is focused on the supply of a bespoke development together with a dedicated production service for low & medium volume products within the high technology sector.

Gemini adopt an open and flexible approach with all its clients, we are committed and reliable supply partner that delivers technical and commercial value - in today fast moving and competitive market.

Milestones & achievements in the company history

1974 - Design office opened, supplying PCB design service.

1980 - First CAD design tools installed (RACAL-REDAC)

1982 - PCB bare board manufacturing operation opened, single & double sided PCB's.

1983 - PCB laser plotting and CAM installed, PCB testing installed

1989 - Artwork Scanning bureau opened - networked across Europe.

1990 - PCB multilayer manufacture introduced, PCB AOI inspection introduced.

1991 - Blind & buried via introduced

1994 - Move to new factories (Unit 1 The Brook Trading Estate)

1996 - PCB Automated platting lines & 3 flying probe testers added.

1997 -Dedicated supply chain in Pacific Asia for larger volume orders

1998 - Assembly service commenced with prototype builds.

1999 - BGA technology added: Placement, removal with X-ray and ERSAcope.

2001 - First SMT line added, opening of new factory (Unit 2 The Brook Trading Estate)

2002 - Second SMT line added, automated in-line cleaning of PBA's.

2003 - Third SMT line added, functional test department opened.

2004 - AOI (optical inspection) on all assemblies.

2005 - New reflow capability, Lead Free assemblies processed.

2006 - Q3: Automated soldering, BGA capability upgrade.

2006 - Q4: New CEM & SMT facility opens.

2007 - New printed electronics production facility opens, for volume RFID production.

For a complete capabilities list and technology road map please contact us.