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Solder Jet Printing Technology at Gemini Tec Ltd

Gemini Tec Ltd were the first UK based CEM to introduce 'Solder Jet Printing' for the application of solder paste across its entire manufacturing process. Solder Jet printing is 100% stencil free.

'Solder Jet Printing' is widely adopted by class leading technology companies across Europe and Asia. The process has many distinct advantages over the use of traditional 'Stencils' in the manufacture of PCB assemblies. This significant change in technology was introduced to all products in 2008, delivering recognisable improvements to the finished product.

Commenting on the new technology. Adam Harsant states "This is another example of our commitment to remain at the forefront of PCB technology, and re-enforce our market position as providers of technology products."

 


"Customers often tell us about the difficulties in finding a supplier that can successfully produce high quality technology products, for low volume applications. So we are delighted to be the first UK CEM, to build next generation PCB assemblies"



Technical Advantages

Solder jet paste application removes the technical constraints of successfully soldering technology devices such as QFN's, BGA's and micro BGA devices onto PCB's.
It is widely known that over 80% of manufacturing problems are a direct result of missing paste, insufficient solder and solder bridges - solder jet printing addresses all these problems.


Such a change in manufacturing technology translates directly into high reliability solder joints, for every device on the board - regardless of the component mix.


Downtime is minimised during product development, by removing the errors of un-soldered pins on complex SMT components. (Highly important, when many prototypes are supplied un-tested by the CEM)

Leading edge MYDATA capability allows 100% repeatability when depositing solder paste onto PCB footprints. A process that is also checked optically during the application. Solder jet printing allows the amount of solder paste to be tailored to the exact requirements of each device on the PCB, ensuring the formation of the joint, post reflow. A process that is not achievable, when using conventional 'stencils'.


Commercial Advantages

Solder jet printing does not require the investment into traditional 'Stencils' that quickly become obsolete through design changes, providing tangible commercial advantages. Our rapid prototyping service now becomes more flexible. We can provide technology products to IPC610A class 3 quality, without the associated delays and costs associated with the use of traditional 'stencils'.
If you wish to discover the benefits this technology can provide your company, please contact us. Data Sheets and white papers can be downloaded from our download centre.

 

 

Need Help?

Call 01252 333 444 for helpful advice on sub-contract manufacture. sales@geminitec.co.uk


No Stencil Costs

The first UK based CEM to introduce 'Solder Jet Printing' for the application of solder paste, removing the need to use stencils. Read more about how this technology will provide high yield SMT products...


X-JTAG Enabled

Gemini Tec provide a complete range of high technology assembly services, and are JTAG enabled.    
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