We
offer a dedicated service, aimed to assist clients with prototype and
low volume production.
We prefer to work closely with clients during the development phase to provide a seamless transition to production - we can provide advice and expertise in the design of your printed circuit board design to achieve cost effective and reliable board manufacture.
The latest technology in the UK allows us to use the solder paste & reflow process, without the need to invest in stencils. Stencils quickly become obsolete during the prototype phase, contributing significantly to the cost of manufacturing in low volume.
Our stencil free process allows complex prototypes to be made quickly and accurately. SMT parts can be placed by hand or machine, followed by a reflow process to ensure optimum quality.
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We do not have the technical restrictions of using traditional stencils. This provides a distinct technical and commercial advantage to our customers.
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MY500 Stencil Free Printing at Gemini
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Complex PCB assemblies are produced to IPC standards from 1 off upwards. |
Technology Solutions Provider We can supply high technology assemblies on rapid timescales. Typical products that Gemini manufacture contain multiple BGA & leadless devices. Leading edge equipment allows the placement, removal and inspection of BGA's on high technology PBA's. PBA's are built to the same quality level as production boards, IPC610A Class 2 or 3. All assemblies are fully inspected using the latest automatic (AOI) and manual inspection methods prior to completion & release.
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| If you have are seeking a new manufacturing partner for your products, contact us to arrange a consultation. | ||
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