 |
|
 |
|
We
have many years expertise in BGA and leadless device assembly. Our combined
technical knowledge and cutting edge tools help customers gain access
to the higher technology sector. We are able to supply a pain-free transition
to this sector, supporting products in both prototype and development
activities.
Gemini is equipped to undertake a wide scope of complex technology work, and typically the products we manufacture have multiple BGA devices and leadless devices.
Service features:
- Experienced & reliable company.
- Multiple BGA, CGA, QFP, LPBGA, LCC, TSOP, flip-chip (all current technology).
- ERSAscope optical inspection.
- X-ray inspection.
- Placements from 1 off upwards.
- Controlled removal/rework if ever required.
- Re-balling of faulty or used devices.
- No stencil manufacturing required.
Equipment features: ERSA IR650
- Semi Automatic BGA rework System 
|
The ERSA IR650 uses the latest technology to remove and place BGA BGA, flip-chip and fine pitch devices for process development and production.
|
In-house Real time inspection - Optical
All BGA placements and rework that is
undertaken by Gemini are completed with a 100% inspection and/or AQL levels
for production, using advanced optical inspection from ERSAscope.
In-house real time inspection - X-ray
In addition to optical inspection, we use an X-Tek 'pan & tilt' X-ray system to assist in all BGA and specialist components inspection.
The pan & tilt facility allows for 3 dimensional inspection , i.e. finding collapsed spheres under BGA devices. Using both technologies allows Gemini to provide additional product guarantees on all PCB assemblies.
If you require assistance with high reliability complex assemblies, or if you are looking to develop products with new technology contact Gemini to understand how we can assist you.
|
Gemini Tec Ltd |
 |
 |
|