We
have expertise in BGA assembly & re-work suitable for development, prototype
and batch production.
Dedicated engineers produce the correct temperature profile and process controls for each BGA based PCB, including ceramic, plastic, metal and micro BGA's of any size.
Investment in ERSAscope optical inspection technology and 3D X-ray inspection is used to veify quality placements time after time.
Service features:
- Experienced & reliable company.
- BGA, CGA, QFP, LPBGA, LCC, TSOP, flip-chip (all current technology).
- Cost effective ERSAscope optical inspection in-house.
- Optional X-ray inspection in-house.
- Placements from 1 off upwards.
- NC controlled placement and removal/rework.
- Thermal profiling engineered in-house.
- Re-balling of faulty or used devices in-house.
- Fault investigation service.
- No stencil manufacturing required.
- Rapid delivery including same-day (subject to booking).
The correct placement and rework of ball grid array devices (BGA) and other fine pitch components can be both costly and time consuming. The ability to lift and place fine-pitched devices with 100% success can be achieved by accurately assessing the reflow profile and carrying out the subsequent process stages under controlled conditions. At Gemini we maintain probably the most advanced system in the world, capable of handling critical operations of this type whilst ensuring the characteristics of the PCB itself are unaffected.
ESD controlled BGA rework facility, at Gemini.
Equipment features: ERSA IR650 - Semi Automatic
BGA rework System 
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The ERSA IR650 uses the latest technology to remove and place BGA BGA, flip-chip and fine pitch devices for process development and production.
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Real-time BGA inspection
In-house Real time inspection - Optical
All BGA placements and rework that is
undertaken by Gemini are completed with a 100% inspection and/or AQL levels
for production, using advanced optical inspection from ERSAscope.
Capability:
Any known BGA or SMT device including flip-chip, CBGA, and micro BGA's.
Service features:
- Inspection included on orders with ball grid array devices.
- Intense real-time imaging under and around the BGA device.
- Highlights the many problems not seen during the x-ray process.
- Exposure of excess flux residues.
- Exposure of conductive particles (short circuits).
- Analysis of the surface structure for cold joints and micro cracking. (Open circuits)
- Highly cost effective and non destructive.
- Fault analysis and rework for faulty devices.
- Electronic report with digital images supplied on all orders.
In-house real time inspection - X-ray
In addition to optical inspection, we use an X-Tek 'pan & tilt' X-ray system to assist in all BGA and specialist compoents inspection.
The pan & tilt facility allows for 3 dimensional inspection , i.e. finding collapsed spheres under BGA devices.
Using both technologies allows Gemini to provides additional product guarantees on all PCB assemblies.
X-Tek real time X-ray system for 3 dimensional inspection
Capability:
Any known BGA or SMT devices including flip-chip, CBGA, and micro BGA's.
Service Features:
- Intense real-time X-ray image intensifier, with high resolution CCD camera.
- A complete 'pan and tilt' facility allows for 3D analysis (I.e. collapsed spheres)
- Inspection suitable for BGA devices, composite components, ceramics and assemblies.
- Optimal inspection results are achieved when used in conjunction, with optical inspection.
- Fault analysis and rework for faulty devices.
- Electronic report with digital images supplied on all orders.
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