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CEM Services Solder Jet Printing
Solder Jet Printing Technology at Gemini Tec
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Gemini Tec Ltd were the first UK based CEM to introduce 'Solder Jet Printing' for the application of solder paste for high yield PCB assembly.
Using a revolutionary technology for solder paste application the MY500 jets solder paste on demand at a rate of 1.8 million dots per hour. Complex 3D paste deposits can be achieved to perfectly match the requirements of every device, suitable for complex high density surface mount PCBs.
It is widely accepted within the PCB assembly market that 80% of errors on PCBs are due to solder paste defects. This stencil free process eliminates many of the known production errors, such as insufficient & excessive solder paste that creates opens and shorts on SMT products.
The use of Solder Jet Printing has many distinct advantages over the use of traditional 'Stencils' in the manufacture of PCB assemblies. Instead of waiting for a stencil to be manufactured and verified we can simply print paste on demand.
The technical advantages of solder jet printing. The use of our MY500 printer removes the technical constraints in solder paste application. Typical errors such as floating devices, opens/shorts on QFN, DFN, BGA devices that often lead to substantial downtime in the assembly process.
This change in technology translates into high reliability solder joints for every device on the board, optimising production time and manufacturing costs.
 This stencil free process can apply solder paste dots small enough to reflow the finest pitch component packages, including PoP. This leading edge process is fast and 100% repeatable. All paste deposits are optically checked using a on-board camera during the application process.
All solder joints fulfill the IPC SM-782A requirements and are tailored to each device. A process that is not achievable when using conventional 'stencils'.
The commercial advantages for solder jet printing.
Solder Jet Printing no longer requires the ongoing investment into traditional 'Stencils', being a 100% stencil free process.
Traditional solder paste stencils quickly become obsolete through design changes or short product life cycles. With our stencil free process there are immediate and ongoing cost saving in tooling and product manufacture.
Print on demand is suitable for rapid PCB assembly to volume production with a lean manufacturing approach. Optimising the production process reduces costs and increases product yields across the supply chain. If you are seeking to increase production yields for complex SMT products, please contact us to find out more about solder jet printing can help you.
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