GTEC UK

Gemini Tec Ltd are the first UK based CEM to introduce 'Solder Jet Printing' for the application of solder paste across its entire manufacturing process for high density PCB assembly.

Using a revolutionary technology for solder paste application the MY 500 jets solder paste on the fly without touching the PCB at a rate of 1.8 million dots per hour - suited to high density PCB assembly.

It is widely accepted within the PCB assembly market that 80% of errors on PCB's are due to solder paste related defects. This stencil free process eliminates typical problems such as placement of the solder paste, missing paste and the correct volume of solder paste. Areas that lead to poor product quality products and lost of re-work.

The use of Solder Jet Printing has many distinct advantages over the use of traditional 'Stencils' in the manufacture of PCB assemblies. There is no longer a need to order, wait for, clean, store or handle stencils, drastically minimizing the cost, time and materials.

Instead of waiting for a stencil to be made and shipped, Gemini simply tool direct from the CAD data to set up a new program. It also ends the need for harsh cleaning chemicals that are damaging to employees and the environment.

Technical Advantages:

MY500 Solder Jet Printer for stencil free printing

The use of our MY500 Solder Jet Paste application removes the technical constraints to successfully soldering package devices such as QFN, DFN, BGA and micro BGA devices.

This change in technology translates to high reliability solder joints, for every device on the board, regardless of the mix of parts.

Downtime is minimised by removing the errors of un-soldered pins on complex SMT components. Our Leading edge MYDATA capability allows 100% repeatability when depositing solder paste onto PCB footprints. A process that is also checked optically (AOI) during the application of the paste.

This stencil free process can apply solder paste dots small enough to reflow the finest pitch mainstream component packages in use today. It is not uncommon for us to build boards with over 10 BGA and leadless devices per assembly. All these solder joint fulfills IPC SM-782A requirements.

Our MY500 allows the solder paste to be tailored to the exact requirements of each device on the PCB, ensuring the formation of a optimum solder joint. A process that is not achievable, when using conventional 'stencils'.

Commercial Advantages:

MY500 Solder Jet Printer for stencil free printing

Solder Jet Printing with our MY500 does not require the ongoing investment into traditional 'Stencils'. It is a stencil free process.

Old style stencils ca quickly become obsolete, through design changes or short life cycles. As there is no need to purchase stencils, this provides our clients a tangible commercial advantage.

Many of our customers need to amend the PCB design after the initial prototype. With our stencil free process there is no longer a need to buy new stencils, should PCB need updating.

The tooling can often be a major cost factor for prototype PCBs, with SMT devices on both sides. Thankfully with our stencil free process these costs can be saved, allowing a commercial advantage.

Due to the short time frame for setting up new products, we can continue to offer our rapid prototyping service for high mix technology products.

Download a technical white paper on Solder Jet Printing courtesy of MYDATA.