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We have many years of expertise in manufacturing high density PCB assemblies that use BGA and leadless devices (BGA devices, QFN, DFN Devices). Our combined technical knowledge and class leading tools allow customers to obtain technology manufacturing capability, at a cost effective price point.
We are a technically advanced sub contract manufacturer for complex PCB assemblies, with full BGA/leadless processing capability.
- Experienced in BGA & Leadless device assembly.
- Solder Jet Printing Technology.
- 100% Stencil Free technology.
- ERSAscope optical inspection & 3D X-ray inspection.
- Accurate placement of BGA, QFN, DFN type devices.
- 1 off placements.
- Controlled removal/rework.
- Re-balling of faulty or used devices.
- X J-Tag testing.
- No stencil manufacturing, allows quick set-up & no tooling costs.
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Typically the products we manufacture have multiple BGA and leadless devices. (i.e. Micro BGA, DFN, QFN, CSP, PoP etc) The products we make are for a variety of end users including broadcast, mobile & network infrastructure, telecoms, VoIP, transportation and high performance embedded computers.
BGA/QFN & Leadless chip placement for Rapid turn prototypes
We utilise the latest ERSA IR650 technology to remove and place BGA, Leadless, flip-chip and fine pitch devices for prototype and development boards. Our ERSA placement system allows us to work with large PCB sizes, up to 460 x 560 mm. Gemini Tec process engineers will design custom thermal profiles to ensure the accuracy of the placement and reflow process.
ERSA tools allow a controlled and non-destructive process for BGA placement, with a IR reflow process. The controlled heating of the PCB will ensure no damage to the PCB itself. Devices can then be removed and replaced with ease and 100% accuracy.
BGA & Leadless device inspection
We use ERSA optical inspection tools for real-time inspection to provide clear and concise confirmation of our process control.
ERSA optical inspection allows us verify our process by extracting measurement's and data, post reflow.
3D X-Ray inspection
3D pan & tilt X-Ray allows for 3 dimensional inspection is also conducted on site at Gemini Tec. X-Ray inspection is a highly effective tool to confirm the process control and solder quality under devices on PCB's, such as BGA's.
Using a range of proven processing techniques together with a range of inspection and test methods will ensure product conformance.
Contact us to discuss your exact requirements in SMT or BGA product manufacture.
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