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Advanced Electronic Manufacturing Services

Gemini Tec are a leading technology CEM (Contract Electronic Manufacture) based in the UK.4_180

We work closely with our customers to supply prototype to medium volume production high density PCB assemblies, within the high technology sector. Many of our customers have a range of volumes and technology, but all our customers gain access to our specialist skills and cutting edge resources. We are a well organised and pro-active contract assembly company, who take great care to deliver a service that buyers and engineers recommend.


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Our service ensures all the key concerns and requirements are addressed, in a logical and well-executed manor, allowing our customers to enjoy subcontracting their complete EMS needs to Gemini. We provide many solutions to manufacture high density surface mount, BGA and Leadless technology products.




All our services are conducted from our purpose designed and superbly equipped ESD facility in Hampshire, UK. All our staff are trained to recognised IPC standards, ensuring your PCB products conform to IPC610A class 2 or 3. Planning and scheduling is conducted with real time software to ensure that all delivery requirements are made on time, any delays are easily communicated to our customers.

What We Do Best24_180
  • Complex high density & mixed technology PCB assembly.
  • Rapid delivery prototype service upto mid volume production.
  • Assembly of BGA, Micro BGA and Leadless devices.
  • Functional, ICT & AOI Testing.
  • Specialist support with PCB design layout using Altium, PADS & Cadence.
  • Material procurement & kitting.
  • Specialists support with PCB bare board manufacturing)
  • Recognised IPC-A-600 & IPC-A-610 class 2 & 3 quality standards.

Continued and sustained investment into leading edge production equipment allows technology products to be manufactured and checked for conformance. The use of AOI inspection on all PCB assembly ensures batch to batch reliability to IPC standards.

The very latest solder jet printing technology for high density PCB manufacture is available. This class leading process removes the constraints that traditional solder paste application does not allow. We are suitably placed to provide technology based surface mount assembly boards for the most demanding high density PCB designs. Click here to read more or download a technical white paper to know more.

Our advanced manufacturing facility has a wide range on leading edge equipment.

 

  • Quick change, MYDATA surface mount lines - over 50,000 cph.
  • MYDATA MY500 Solder Jet Printing - Stencil Free process.
  • Plasma Vapour phase soldering process for high density PCB products.
  • Convection air soldering process & wave solder process.
  • Leaded & Lead Free, for Avionics & MOD customers.
  • ERSA IR650 placement station for complex assembly and re-work.
  • X-Ray & ERSAscope to inspect Leadless & BGA, QFN, DFN and CGA devices.
  • Removal, Re-work and Re-balling of BGA devices.
  • Automatic Optical Inspection line (AOI) - Zero defect & IPC 610A class 3.
  • Aqueous board cleaning & Ultrasonic & Vapour Solvent cleaning for J STD-001 D.
  • Selective Conformal Coating process in house. (Non masking process)

As a CEM (Contract Electronics Manufacture) we undertake full box build products and turnkey projects, from enclosures to final product test. All our production is located within our modern purpose designed ESD controlled facility in Hampshire. We build and test a variety of products working in close partnership with our end customers. Typically these markets are the Rail Industry, Satellite Test Equipment, Gas Detection and High performance embedded computers.

Full turn key assembly products can include cable harness and looms. We often build products with quantities from 10 units upwards, allowing the benefits of outsourcing full production available to specialist OEM companies.

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Our Turnkey PCB Assembly Services Include:

  • Automatic cable manufacture & wire looms.
  • Press fit applications for back-plane and rack-mount solutions.
  • Functional test services.
  • J-TAG boundary Scanning.
  • RTB, Fault finding expertise with diagnose & fixing capability.
  • Complex re-work of BGA products, with on-site X-Ray and inspection.
  • Test jig design & manufacture.
  • Device programming.

 
 

Solder Jet Printing

We are the first UK based CEM to introduce 'Solder Jet Printing' for the application of solder paste for BGA & Leadess devices. Removing the cost of buying stencils.


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Gemini Tec provide a complete range of high technology assembly services, and are JTAG enabled.    
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