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Solder Jet Printing
In 2008, Gemini Tec were the first UK based CEM to introduce 'Solder Jet Printing' technology for surface mount PCB assembly.
Our MYDATA MY500 is the revolutionary technology that applies solder paste directly onto the PCB, without the need to use stencils. With over 80% of typical production errors attributed to poor solder paste application 'Solder Jet Printing' provides the technical solution.
Solder paste deposits are placed on demand at rate of 1.8 million dots per hour. The optimum volume of solder paste is applied to every pad position on the PCB, to create the ideal reflow conditions. The result ensures all typical production errors are removed (i.e. floating QFNs, excessive solder, short and opens etc) and allows high yield results for all SMT products.
The use of 'Solder Jet Printing' has many commercial & technical advantages for Gemini Tec and its customers.
- 100% accurate and 100% repeatable, without deviation.
- No stencil tooling costs on new, repeat of modified designs.
- Optimum solder joints produced, with typical yields of 100%.
- Tooling and process development conducted in real time.
- Reduced manufacturing lead times.
- Reduced manufacturing costs.
- Best suited tor complex & high density surface mount PCB designs.
‘Solder Jet Printing’ technology is used across the entire manufacturing process at Gemini Tec. All our customers benefit from this leading edge technology regardless of the quantity we produce.
In 2011 Gemini Tec placed 18018 BGA devices, with a 100% yield. Click here to see this technology in action.
